Dabo Metal
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Low price, excellent material properties and other characteristics, is gradually replacing the bonding gold wire is widely used in the field of electronic packaging.
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The main features include low price, good conductivity, good light reflection and good heat dissipation, but the application of old-fashioned wire bonding equipment is not mature or requires nitrogen protection.
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Mainly used in the manufacture of semiconductor devices when the back layer metal coating includes evaporated gold wire, gold segment, evaporated gold arsenic wire, gold arsenic segment, evaporated silver.
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