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Dabo Metal

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Copper wire series


Low price, excellent material properties and other characteristics, is gradually replacing the bonding gold wire is widely used in the field of electronic packaging.

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Silver wire series


The main features include low price, good conductivity, good light reflection and good heat dissipation, but the application of old-fashioned wire bonding equipment is not mature or requires nitrogen protection.

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Excellent scale enterprise


Mainly used in the manufacture of semiconductor devices when the back layer metal coating includes evaporated gold wire, gold segment, evaporated gold arsenic wire, gold arsenic segment, evaporated silver.

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Beijing Dabo Nonferrous Metal Solder Co., Ltd. is a national high-tech enterprise registered in Zhongguancun National Independent Innovation Demonstration Zone. It is China's IC packaging and testing industry chain technology innovation alliance.

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Telephone:

+86-010-84924319

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Address:

40 Beiyuan Road, Chaoyang District, Beijing


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