Dabo Metal

Copper wire series

Low price, excellent material properties and other characteristics, is gradually replacing the bonding gold wire is widely used in the field of electronic packaging.

Silver wire series

The main features include low price, good conductivity, good light reflection and good heat dissipation, but the application of old-fashioned wire bonding equipment is not mature or requires nitrogen protection.

Excellent scale enterprise

Mainly used in the manufacture of semiconductor devices when the back layer metal coating includes evaporated gold wire, gold segment, evaporated gold arsenic wire, gold arsenic segment, evaporated silver.