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PRODUCTS

BEIJING DABO NONFERROUS METAL SOLDER

Beijing Dabo Product Introduction

The bonding wire is widely used in the field of electronic packaging as a connecting line between the chip and the frame, and mainly includes gold wire, silver wire, copper wire, aluminum wire and the like. Among them, gold wire, silver wire, copper wire, alloy wire, palladium copper wire and the like are applied to the thermocompression bonding and thermosonic bonding process, and the aluminum wire is generally used for the ultrasonic bonding process. The choice of bond wire depends on the customer's requirements, package form, cost, different bonding processes and bonding equipment have different requirements for the product. The material and wire diameter of the bonding wire have an influence on the shape, height and strength of the wire arc when bonding, and the oxidation resistance, electrical properties, reliability, and the like are also different. In order to ensure the consistency of the bonding wire products, the bonding wire must meet the following requirements:
• Product line consistency
• Stability when temperature changes
• Clean silk surface
• Smooth pay-off performance and linearity
• High bonding reliability and good arc shape
The high reliability and high quality of the bond wire depend on strict composition control, stable product characteristics and strict process control.

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Gold wire series

Bonding wire is an electronic packaging material used in semiconductor packaging.

Alloy wire series

The characteristics mainly include acid and alkali resistance, corrosion resistance, good toughness, high strength, and good electrical conductivity, thermal conductivity, high elasticity, flexibility

Copper wire series

Low price, excellent material properties and other characteristics, is gradually replacing the bonding gold wire is widely used in the field of electronic packaging.

Silver wire series

The main features include low price, good conductivity, good light reflection and good heat dissipation, but the application of old-fashioned wire bonding equipment is not mature or requires nitrogen protection.

Excellent scale enterprise

Mainly used in the manufacture of semiconductor devices when the back layer metal coating includes evaporated gold wire, gold segment, evaporated gold arsenic wire, gold arsenic segment, evaporated silver.

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Beijing Dabo Nonferrous Metal Solder Co., Ltd. is a national high-tech enterprise registered in Zhongguancun National Independent Innovation Demonstration Zone. It is China's IC packaging and testing industry chain technology innovation alliance.

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Telephone:

+86-010-84924319

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Address:

40 Beiyuan Road, Chaoyang District, Beijing


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