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BEIJING DABO NONFERROUS METAL SOLDER
Research Project
Beijing Dabo's research projects
|
Project Name |
Project Type |
Starting and ending years |
Project focal point |
|
Development and industrialization of bonding wires for advanced packaging |
National Eleventh Five02Major science and technology projects |
2009-01-2011-12 |
National Science and Technology |
|
Bonded copper wire for high-end packaging |
National Twelve Five02Major science and technology projects |
2012-01-2014-12 |
Major science and technology projects |
Beijing Dabo Nonferrous Metal Solder Co., Ltd. is a national high-tech enterprise registered in Zhongguancun National Independent Innovation Demonstration Zone. It is China's IC packaging and testing industry chain technology innovation alliance.
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40 Beiyuan Road, Chaoyang District, Beijing
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