Company Introduction

Beijing Dabo Nonferrous Metal Solder Co., Ltd. is a national technology enterprise registered in Beijing Zhongguancun Science and Technology Park, which was established on December 16, 1999.

Dabo's main products are integrated circuit (IC), semiconductor lighting (LED), camera module and semiconductor discrete device (TR) packaging with bonding gold wire, bonding copper wire, bonding silver wire and various alloy wire series products. At the same time, it also produces evaporated gold, evaporated gold arsenic and evaporated silver wires and segments for chip back gold evaporation.

Dabo Company has a complete production line of bonding gold wire, copper wire and silver wire. The production equipment and testing instruments have reached the international level, and can provide more than 1 billion meters of bonding wire every year.

Adhering to the scientific management concept, Dabo has passed the certification of ISO9001 and TS16949 quality management system, ISO14001 environmental management system and QC080000 hazardous substance process control management system.

Dabo Company has always adhered to independent research and development and successfully built a multi-variety bonding wire product family consisting of bonding gold wire, gold alloy wire, bonding copper wire, palladium-plated copper wire, gold-palladium copper wire, gold-copper wire, bonding silver wire, gold-plated silver wire, silver alloy wire, gold-plated alloy wire, gold-plated palladium alloy wire and other precious metal materials. The company has a wide range of products and complete models. Differentiated products can match different types of packaging requirements, meet customer personalized customization needs.

Dabo Company has strong R & D strength and mastered the core technology of bonding wire production process. It has successively undertaken the project "Research and Development and Industrialization of Advanced Packaging Bonding Wire" of the National Science and Technology Major Project "Very Large Scale Integrated Circuit Manufacturing Equipment and Complete Process" of the Eleventh Five-Year National Science and Technology Major Project "Communication and Multimedia Chip Packaging and Testing Equipment and Material Application Project" "High-end Packaging Bonding Copper Wire", all successfully passed the subject acceptance.

It has been rated as "Top Ten Semiconductor Materials Enterprises in China" for many years ".

Dubo has always been committed to providing customers with satisfactory, high-quality and stable products and services.