Evaporated gold is mainly used for back metal plating when manufacturing chips for semiconductor devices. It is a noble metal material that is deposited on the surface of a semiconductor chip through a specific process to form a metal-semiconductor ohmic contact film. The application of evaporated gold materials is not limited to military and civilian microwave communication devices, such as MIMO antennas, but also includes high conversion semiconductor compound chips, such as GaN, used in important fields such as aerospace. The preparation and application of evaporated gold is not limited to gold, but also includes alloys of gold and other elements, such as pure gold, gold germanium, gold germanium nickel, gold beryllium, gold gallium, gold tin and other alloy particles and sputtering targets. These materials are deposited on the surface of semiconductor chips such as gallium nitride, gallium arsenide, and gallium phosphide through specific processes, which are essential for improving the performance and reliability of semiconductor devices.