Bonding gold wire is a kind of electronic packaging material used for semiconductor packaging. Metal wires are used to weld between the semiconductor chip pins and the package bracket. This technology has been widely used and has become an indispensable part of semiconductor manufacturing. Widely used in semiconductor packaging, automotive electronics, aerospace and other fields. In the field of semiconductor packaging, bonding gold wire has become the mainstream technology, applied to the connection between the chip and the package bracket. In the field of automotive electronics, bonding wires are used to manufacture electronic components in automotive control systems to ensure the stability and reliability of the control system. In the field of aerospace, bonding wires are used to make small connections in aerospace electronic components, which can meet the requirements of high temperature, high stress and high reliability.