The main features of bonding silver wire include low price, good conductivity, good light reflection and good heat dissipation, but it is not mature in the application of old-fashioned wire bonding equipment or nitrogen protection is required.

cheap priceThe price of the bonding silver wire is about 1/5 of the same wire diameter gold wire, which gives it a clear advantage in cost, especially in the semiconductor packaging industry that requires a large number of bonding wires, the large-scale application of the bonding silver wire can significantly reduce production costs.

good conductivityAlthough silver is not as conductive as gold, in practical applications, the conductive properties of the bonded silver wire are sufficient for most applications, especially in the case of a balance between cost and performance.