Bonding copper wire is gradually replacing bonding gold wire widely used in the field of electronic packaging because of its low price and excellent material properties. Bonding copper wire is a key material in semiconductor packaging technology, and its application and development trend have attracted wide attention. The bonding copper wire has been widely used in diodes, transistors, integrated circuits, large-scale integrated circuits and other semiconductor devices as inner leads. Especially in the field of high-end products such as leadless packaging and small pitch pads, the bonding copper wire also shows good use potential.