Alloy wire
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Bonding wire is an electronic packaging material used in semiconductor packaging.
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The characteristics mainly include acid and alkali resistance, corrosion resistance, good toughness, high strength, and good electrical conductivity, thermal conductivity, high elasticity, flexibility
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Good News | Dabo Party Branch Won "Two Excellence and One First" Recognition
On the 103 anniversary of the founding of the Communist Party of China Dabo Party Branch and 4 Individuals Commended by Higher Party Organization Let's look at the advanced and learn from the example.
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Dabo Party Branch Convenes Party Member Conference
The meeting pointed out that it is necessary to deeply realize that the newly revised Regulations are the latest achievement of our party's discipline construction in recent years, an important institutional guarantee for comprehensive and strict governance of the party
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Guan Xuan! Signing Ceremony of Dabo's Acquisition of Tongda Electronic Equity Project Held
On March 6, Beijing Dabo Nonferrous Metal Solder Co., Ltd. and Hebei Letong Metal Materials Co., Ltd. held a signing ceremony for the equity acquisition project in Xingtai City, Hebei Province. Zhou Fatian, assistant to the general manager of Beijing Yiqing Holdings
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Beijing Dabo Nonferrous Metal Solder Co., Ltd. is a national high-tech enterprise registered in Zhongguancun National Independent Innovation Demonstration Zone. It is China's IC packaging and testing industry chain technology innovation alliance.
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40 Beiyuan Road, Chaoyang District, Beijing
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