The bonding wire is widely used in the field of electronic packaging as a connecting line between the chip and the frame, and mainly includes gold wire, silver wire, copper wire, aluminum wire and the like. Among them, gold wire, silver wire, copper wire, alloy wire, palladium copper wire and the like are applied to the thermocompression bonding and thermosonic bonding process, and the aluminum wire is generally used for the ultrasonic bonding process. The choice of bond wire depends on the customer's requirements, package form, cost, different bonding processes and bonding equipment have different requirements for the product. The material and wire diameter of the bonding wire have an influence on the shape, height and strength of the wire arc when bonding, and the oxidation resistance, electrical properties, reliability, and the like are also different. In order to ensure the consistency of the bonding wire products, the bonding wire must meet the following requirements:
• Product line consistency
• Stability when temperature changes
• Clean silk surface
• Smooth pay-off performance and linearity
• High bonding reliability and good arc shape
The high reliability and high quality of the bond wire depend on strict composition control, stable product characteristics and strict process control.