Good News: Another Project of Dabo Company Successfully Passed the Acceptance of Beijing Municipal Science and Technology Commission

On the afternoon of July 29, 2022, the project acceptance meeting of "Research and Demonstration Application of Bonding Gold Wire Preparation Technology for Flash Memory and High-end RF Chip Packaging" was held in Dabo Company. Six expert group members and core project members of Dabo Company attended the meeting..

At the acceptance meeting, the expert group listened carefully to the defense report of Dabo Company, reviewed the acceptance data, and formed the following assessment after inquiry and discussion:

1. Relying on the project, Dabo Company has overcome the key technical problems such as high-purity gold, alloy formula and intermediate alloy, optimized the casting and processing technology, applied big data technology to carry out process management, formed a complete set of industrialization technology of bonding gold wire for high-end packaging, completed the objectives of the project task book, and the technical indicators met the requirements.

2. The two high-performance bonding wire products developed have been verified by key indicators in RF packaging and flash packaging.

3. During the implementation of the project, 10 national patents were applied, including 1 invention patent, of which 8 utility model patents have been authorized.

The acceptance expert group believes that Dabo has completed the research and development tasks stipulated in the project task book and met the requirements of the assessment indicators, and unanimously recommends that the project pass the acceptance.

In the future, with the advent of the Internet of Things, 5G, and artificial intelligence, the market scale of the electronic information industry based on the semiconductor industry will continue to expand. Through the implementation of this topic, Dabo Company will position the market in the high-end semiconductor packaging and testing industry, and plans to comprehensively carry out the research and development of high-end packaging bonding wires and the construction of a testing platform, and finally build a professional service platform covering high-end gold-based bonding wires, silver-based bonding wires, copper-based bonding wires and special bonding wire products, development, production and sales.